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Engineer – Thermal Analysis
Ref No.: 18-60282
Location: Rockford, Illinois
Position Type:Direct Placement
Start Date: 08/20/2018
Candidate will be involved in all aspects of the product thermal design, including proposal support, conceptual and preliminary design, detailed design and thermal testing. Written reports and oral presentations to internal and external customers are required.
Typical projects include transient and steady state thermal analysis of liquid and forced air cooled power electronics (motor drives, converters), and natural convection cooled control electronics. Subassembly thermal analyses include evaluation of high power semiconductors (transitions and diodes), electromagnetics (inductors and transformers) and printed wiring boards. Experience with generator and motor thermal analysis is a plus. Candidate must be able to recommend analysis and testing approaches based on technical risk.

Education:
Bachelors in Mechanical Engineering
An advanced degree with heat transfer emphasis is preferred.
Skills:
Successful candidate should have 10 years mechanical engineering experience in thermal design and analysis of electronic equipment . Proficiency with CFD analytical tools for electronics cooling (ICEPAK, Flowtherm, or others) is essential. Strong verbal and written communication skills are essential.