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Thermo-Mechanical Packaging Engineer IV
Ref No.: 22-09443
Location: Sunnyvale, California
Pay Rate : $ 77.53 /Hour
Job Title:  Thermo-Mechanical Packaging Engineer (37740-1)
Location:  Onsite/Sunnyvale, CA
Job Type:  6 Month Contract *potential for extension
Pay Range: $70.00 to $77.00 per hour
*Access to Health Benefits + PTO

This is an excellent opportunity to join the world's largest social media network who enables over a billion users to openly connect with friends and family, share content, and explore the world.      


Job Description:
Reality Labs (RL) brings together world-class experts to develop and ship groundbreaking products at the intersection of hardware, software, and content. We build seemingly impossible products that define new categories that advance our client's mission of connecting the world. This team has the responsibility for making breakthroughs and delivering them to market at scale. The Applied Materials team at Reality Labs seeks a Thermo-Mechanical Packaging Engineer with the ability to work on groundbreaking thermal solutions for AR and VR devices.

Responsibilities:
  • Understand thermal management systems in Reality Labs' product roadmap and identify risks and opportunities.
  • Develop and qualify advanced thermal management solution-sets using Client technologies, either in-house or in collaboration with suppliers.
  • Determine performance KPIs - outline test plan and execution to hit design targets
  • Build test rigs to help qualify above solution-sets from CAD/concept to final set up
  • Characterize thermal, mechanical, and electrical properties of advanced thermal technologies for cooling consumer electronics.
  • Work with cross-functional partners, providing guidance, recommendations and next steps and manage work streams across different geographies
  • Identify process windows and seamlessly transition technology from development to high volume production.
  • Present regular updates on learnings and results to internal /external teams and bring to teams to consensus.
Minimum Qualifications:
  • B.S. in Mechanical Engineering, Applied Physics or other relevant degree.
  • 5+ years of experience with thermal characterization of hardware in a lab setting
  • Comfortable in a lab environment - proficient with hands-on lab work and logistics
  • Solid thermal background - experience with all modes of heat transfer
  • Good knowledge of heatsinks, graphites, TIMS, fan/blowers, and advanced thermal solutions
  • Thermal design of PCB and PCBA constituents
  • Good knowledge of IR, thermography, and in-situ thermal characterization
  • Familiar with metrology tools both in thermal and mechanical space in order to characterize various performance parameters, e.g., thermal conductivity, emissivity, air velocity, Wheatstone bridge (strain measurements), etc.
  • Excellent communications and presentation skills
  • Inquisitive and takes initiative - problem solver
  • Uses an analytical approach and drives projects to closure
Standout Qualifications:
  • M.S. in Mechanical Engineering, Applied Physics or other relevant discipline.
  • 10+ years of experience with thermal characterization of hardware packaging, heat sinks and cooling solutions.
  • Good knowledge of CAD, fixture design, machine shop capabilities, and manufacturing processes
  • Familiarity with thermal software tools (Icepak, Flotherm)
  • Knowledge of JMP and MINITAB